MC SUPER PRO5 Super runway workstation
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- Product description
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Six major advantages
1. The newly equipped Xeon "central brain" (five channels of the Han's system) opens up the overall network and provides a smarter experience.
2. Independent five channels - independent processing areas to avoid interference and more efficient collaborative work.
3. Track-type laser cutting device - longer stroke, no time required for corner code hole/glue injection hole process.
4. Intelligent manipulator - automatic error correction function of the manipulator, material clamping induction, automatic rotation, and intelligent memory.
5. Any angle cutting of the upper saw blade - can cut any angle and corner guard to meet a variety of processing needs.
6. Independent corner guard cutting device - equipped with an independent tail knife corner guard cutting device, it is more than fast.Technical Parameter
MC-SUPER PRO 5
01
Overall dimensions (length * width* height)
17500*3500*2500mm(不含排屑机尺寸)
02
Chip removal machine size (length * width * height)
约3150mm*500mm*700mm
03
Total weight
约11吨
04
Input power supply
380V/50Hz 三相四线制
05
Working air pressure
1.6MPa
06
Cutting speed
15-50m/min
07
Servo operating speed
40-130m/min
08
Blank length
1100≤L≤7000mm
09
Sawing length
≥300mm
10
Allowable feeding quantity of feeding table
6+1 支循环式
11
Saw blade diameter
Ф550mm
12
Cutting angle
45°、-45°、90”可任意组合切割
13
Cutting mode
下出 45°,上锯片任意角旋转
14
Profile processing height
130mm
15
Profile processing width
130mm
16
Drilling method
一个后出,一个上出,一个下出,一个前出(摆角)
17
Laser processing mode
后激光切割+划线,前激光划线
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